8.Soldering

8-1, Lead free soldering

(1) Following soldering paste is recommended

Melting temperature : 216 ~ 220C.

Composition : Sn 3.5Ag 0.75Cu

(2) The temperature profile at the top surface of the parts is recommended as shown below.

(3) It is requested that products should be handled after their temperature has dropped

down to the normal room temperature

8-2 Recommended soldering pattern

Mountability and solderability need to be

optimized with actual conditions such as

amount of solder, reflow temperature

applied in the process.

8-3. Recommended pickup nozzle

Shape

: Circular

Dimension

: Diameter more than 1.5mm

8-4. Washing

(1) When washing after soldering is needed, following conditions are requested.

a) Washing solvent: Pure Water

b) Temperature, time: 50C or less × 30 seconds max or 30C or less × 3 minutes max.

CITIZEN ELECTRONICS CO.,LTD. JAPAN

Symbol

DATA SHEET

9/13

CITILED

Name

CLL630-0101B2-27AM1A2

140sec

160

4

Time

4

260

220

°C

60

Anode Pad

Outline

Cathode Pad

Ref.CE-P2520 07/13 R1(0214)