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OPA691IDRG4 Datasheet(PDF) 2 Page - Texas Instruments |
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OPA691IDRG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 31 page OPA691 2 SBOS226D www.ti.com SPECIFIED PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY OPA691ID SO-8 D –40 °C to +85°C OPA691 OPA691ID Rails, 100 "" " " " OPA691IDR Tape and Reel, 2500 OPA691IDBV SOT23-6 DBV –40 °C to +85°C OAFI OPA691IDBVT Tape and Reel, 250 "" " " " OPA691IDBVR Tape and Reel, 3000 ABSOLUTE MAXIMUM RATINGS(1) Power Supply .............................................................................. ±6.5VDC Internal Power Dissipation(2) ............................ See Thermal Information Differential Input Voltage .................................................................. ±1.2V Input Voltage Range ............................................................................ ±V S Storage Temperature Range: ID, IDBV ......................... –65 °C to +125°C Lead Temperature (soldering, 10s) .............................................. +300 °C Junction Temperature (TJ ) ........................................................... +175°C ESD Performance: HBM .............................................................................................. 2000V CDM .............................................................................................. 1500V NOTES:: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. (2) Packages must be derated based on specified θ JA. Maximum TJ must be observed. PIN CONFIGURATION Top View SO Top View SOT PACKAGE/ORDERING INFORMATION(1) ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 1 2 3 4 8 7 6 5 NC Inverting Input Noninverting Input –V S DIS +V S Output NC NC = No Connection 1 2 3 6 5 4 Output –V S Noninverting Input +V S DIS Inverting Input 12 3 65 4 OAFI Pin Orientation/Package Marking NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this document, or see the TI website at www.ti.com. |
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