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TPS3700QDDCRQ1 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS3700QDDCRQ1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 26 page TPS3700-Q1 SLVSCI7A – MARCH 2014 – REVISED APRIL 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings Over operating temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD –0.3 20 V Voltage(2) OUTA, OUTB –0.3 20 V INA+, INB– –0.3 7 V Current Output terminal current 40 mA Operating junction temperature, TJ –40 125 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network ground terminal. 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM) ESD stress voltage(2) 2.5 VESD (1) kV Charge device model (CDM) ESD stress voltage(3) 1 (1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device. (2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions Over operating temperature range (unless otherwise noted) MIN MAX UNIT VDD Supply voltage 1.8 18 V VI Input voltage INA+, INB– 0 6 V VO Output voltage OUTA, OUTB 0 18 V 7.4 Thermal Information DDC THERMAL METRIC(1) UNIT (6 TERMINALS) RθJA Junction-to-ambient thermal resistance 204.6 RθJC(top) Junction-to-case (top) thermal resistance 50.5 RθJB Junction-to-board thermal resistance 54.3 °C/W ψJT Junction-to-top characterization parameter 0.8 ψJB Junction-to-board characterization parameter 52.8 RθJC(bot) Junction-to-case (bottom) thermal resistance — (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: TPS3700-Q1 |
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