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BOND PAD ASSIGNMENT

6

10

8

7

9

2

3

1

4

5

M0033-04

GND

GND

GND

OUT

–

RSSI

GND

OUT+

V

CC

ONET4291TA

SLLS670 – SEPTEMBER 2005

The ONET4291TA is available as a bare die. The locations of the bond pads are shown in the following figure.

BOND PAD DESCRIPTION

PAD

TYPE

DESCRIPTION

NAME

NO.

Bias voltage for photodiode (cathode). This pads connects through an internal 220-

Ω resistor to

FILTER

5

Analog

photodiode for the AGC to function.

Circuit ground. All GND pads are connected on die. Bonding all pads is optional; however, for

GND

1, 2, 9, 10

Supply

optimum performance a good ground connection is mandatory.

IN

6

Analog input

Data input to TIA (photodiode anode)

OUT+

3

Analog output

Non-inverted data output. On-chip 50-

Ω back-terminated to V

OUT–

8

Analog output

Inverted data output. On-chip 50-

Ω back-terminated to V

Analog output current proportional to the input data amplitude. Indicates the strength of the

received signal (RSSI). Must be sunk through an external resistor to ground (GND). The RSSI

RSSI

7

Analog output

gain can be adjusted by choosing the external resistor; however, for proper operation, ensure

this pad must be bonded to ground (GND) to ensure proper operation.

4

Supply

3.3-V, +10%/–12% supply voltage

4

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