TPS2342

SLUS572F − OCTOBER, 2003 − REVISED JANUARY 2007

5

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DISSIPATION RATING TABLE

PACKAGE

TA

THERMAL RESISTANCE

JUNCTION TO CASE

ΘJC

THERMAL RESISTANCE

JUNCTION TO AMBIENT

(NOTE 1)

ΘJA

THERMAL RESISTANCE

JUNCTION TO AMBIENT

(NOTE 2)

ΘJA

HTQFP−80 (PFP)

−40

_C to 85 _C

1.1

_C/W

19.3

_C/W

29.4

_C/W

Note 1: Thermal resistance measured using an 8-layer PC board following the layout recommendations in TI Publication PowerPAD Thermally

Enhanced Package Technical Brief SLMA002.

Note 2: Thermal resistance measured using an 8-layer PC board using only top PC board copper to spread the heat.

SERIAL MODE PINOUT

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

24

23

22

21

1234

5

6789 10 11 12 13 14 15 16 17 18 19 20

60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

BUTTONA

SWA

ATTLEDA

PWRLEDA

SODA

SIDA

RSTA

LCA

CLKA

DIGGND1

DIGVCC

CLKB

LCB

RSTB

SIDB

SODB

PWRLEDB

ATTLEDB

SWB

BUTTONB

PWRGND2

V5IN

VIOGA

3VSA

3VISA

5V3VGA

PMEA

PMEOA

PMEOB

PMEB

3VAUXGA

3VAUXA

3VAUXI

3VAUXGB

3VAUXB

5V3VGB

3VISB

3VSB

VIOGB

PWRGND1

PFP PACKAGE

(TOP VIEW)

The heat-conducting pad on the underside of the package is electrically connected to M12VINA. Either connect

other power plane or to ground.