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ISO7842 Datasheet(PDF) 7 Page - Texas Instruments |
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ISO7842 Datasheet(HTML) 7 Page - Texas Instruments |
7 / 37 page 7 ISO7842, ISO7842F www.ti.com SLLSEJ0F – OCTOBER 2014 – REVISED APRIL 2016 Product Folder Links: ISO7842 ISO7842F Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information ISO7842 UNIT THERMAL METRIC(1) DW (SOIC) DWW (SOIC) 16 Pins 16 Pins RθJA Junction-to-ambient thermal resistance 78.9 78.9 °C/W RθJC(top) Junction-to-case(top) thermal resistance 41.6 41.1 °C/W RθJB Junction-to-board thermal resistance 43.6 49.5 °C/W ψJT Junction-to-top characterization parameter 15.5 15.2 °C/W ψJB Junction-to-board characterization parameter 43.1 48.8 °C/W RθJC(bottom) Junction-to-case(bottom) thermal resistance N/A N/A °C/W 6.5 Power Dissipation Characteristics VALUE UNIT PD Maximum power dissipation by ISO78420x VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, input a 50 MHz 50% duty cycle square wave 200 mW PD1 Maximum power dissipation by side-1 of ISO78420x 100 PD2 Maximum power dissipation by side-2 of ISO78420x 100 |
Similar Part No. - ISO7842_16 |
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Similar Description - ISO7842_16 |
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