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OPA111 Datasheet(PDF) 4 Page - Texas Instruments |
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OPA111 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 14 page  4 OPA111 ® DICE INFORMATION OPA111AD DIE TOPOGRAPHY PAD FUNCTION 1 Offset Trim 2 –In 3 +In 4–V S 5 Offset Trim 6 Output 7+V S 8 Substrate Substrate Bias: This Dielectrically-Isolated Substrate is normally connected to common. MECHANICAL INFORMATION MILS (0.001") MILLIMETERS Die Size 95 x 71 ±5 2.41 x 1.80 ±0.13 Die Thickness 20 ±3 0.51 ±0.08 Min. Pad Size 4 x 4 0.10 x 0.10 Backing: None Transistor Count: 44 TYPICAL PERFORMANCE CURVES TA = +25°C, VCC = ±15VDC unless otherwise noted. INPUT CURRENT NOISE SPECTRAL DENSITY 1k Frequency (Hz) 100 10 1 10k 100k 1M 100 10 1 0.1 BM INPUT VOLTAGE NOISE SPECTRAL DENSITY 1k Frequency (Hz) 10k 100k 1M 100 10 1 1k 100 10 1 BM AM, SM |
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