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ISO7821FDWWR Datasheet(PDF) 8 Page - Texas Instruments |
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ISO7821FDWWR Datasheet(HTML) 8 Page - Texas Instruments |
8 / 39 page 8 ISO7821, ISO7821F SLLSEM2F – NOVEMBER 2014 – REVISED MARCH 2016 www.ti.com Product Folder Links: ISO7821 ISO7821F Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated (1) For more information about trdational and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) ISO7821 UNIT DW (SOIC) DWW (SOIC) 16 PINS 16-PINS RθJA Junction-to-ambient thermal resistance 84.7 84.7 °C/W RθJC(top) Junction-to-case(top) thermal resistance 47.3 46.0 °C/W RθJB Junction-to-board thermal resistance 49.4 54.5 °C/W ψJT Junction-to-top characterization parameter 19.1 18.5 °C/W ψJB Junction-to-board characterization parameter 48.8 53.8 °C/W RθJC(bottom) Junction-to-case(bottom) thermal resistance n/a n/a °C/W 6.5 Power Dissipation Characteristics VALUE UNIT PD Maximum power dissipation by ISO7821x VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, input a 50 MHz 50% duty cycle square wave 100 mW PD1 Maximum power dissipation by side-1 of ISO7821x 50 PD2 Maximum power dissipation by side-2 of ISO7821x 50 |
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