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ISO7341CQDWRQ1 Datasheet(PDF) 8 Page - Texas Instruments |
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ISO7341CQDWRQ1 Datasheet(HTML) 8 Page - Texas Instruments |
8 / 35 page 8 ISO7340-Q1, ISO7341-Q1, ISO7342-Q1 SLLSEK5A – JULY 2015 – REVISED AUGUST 2016 www.ti.com Product Folder Links: ISO7340-Q1 ISO7341-Q1 ISO7342-Q1 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated (1) Production tested ≥ 3600 VRMS for 1 second in accordance with UL 1577. 7.7 Safety-Related Certifications VDE CSA UL CQC Certified according to DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 and DIN EN 61010- 1 (VDE 0411-1):2011-07 Approved under CSA Component Acceptance Notice 5A, IEC 60950-1, and IEC 61010-1 Recognized component under UL 1577 Certified according to GB4943.1-2011 Basic Insulation; Maximum Transient Overvoltage, 4242 VPK; Maximum Surge Isolation Voltage, 6000 VPK; Maximum Repetitive Peak Isolation Voltage, 1414 VPK 800 VRMS Basic Insulation and 400 VRMS Reinforced Insulation working voltage per CSA 60950-1-07+A1+A2 and IEC 60950-1 2nd Ed.+A1+A2; 300 VRMS Basic Insulation working voltage per CSA 61010-1-12 and IEC 61010-1 3rd Ed. Single protection, 3000 VRMS (1) Reinforced Insulation, Altitude ≤ 5000 m, Tropical Climate, 250 VRMS maximum working voltage Certificate number: 40016131 Master contract number: 220991 File number: E181974 Certificate number: CQC15001121716 7.8 Safety Limiting Values Safety limiting intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IS Safety input, output, or supply current RθJA = 78.4 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 1 290 mA RθJA = 78.4 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 1 443 TS Safety temperature 150 The safety-limiting constraint is the maximum junction temperature specified in the data sheet. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. |
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