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TLV171IDBVT Datasheet(PDF) 6 Page - Texas Instruments |
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TLV171IDBVT Datasheet(HTML) 6 Page - Texas Instruments |
6 / 38 page 6 TLV171, TLV2171, TLV4171 SBOS783 – SEPTEMBER 2016 www.ti.com Product Folder Links: TLV171 TLV2171 TLV4171 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information: TLV171 THERMAL METRIC(1) TLV171 UNIT D (SOIC) DBV (SOT-23) 8 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 149.5 245.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 97.9 133.9 °C/W RθJB Junction-to-board thermal resistance 87.7 83.6 °C/W ψJT Junction-to-top characterization parameter 35.5 18.2 °C/W ψJB Junction-to-board characterization parameter 89.5 83.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Thermal Information: TLV2171 THERMAL METRIC(1) TLV2171 UNIT D (SOIC) DGK (VSSOP) 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 134.3 175.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 72.1 74.9 °C/W RθJB Junction-to-board thermal resistance 60.6 22.2 °C/W ψJT Junction-to-top characterization parameter 18.2 1.6 °C/W ψJB Junction-to-board characterization parameter 53.8 22.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.6 Thermal Information: TLV4171 THERMAL METRIC(1) TLV4171 UNIT D (SOIC) PW (TSSOP) 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 93.2 106.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 51.8 24.4 °C/W RθJB Junction-to-board thermal resistance 49.4 59.3 °C/W ψJT Junction-to-top characterization parameter 13.5 0.6 °C/W ψJB Junction-to-board characterization parameter 42.2 54.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W |
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