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MC74VHC1G125DFT2 Datasheet(PDF) 2 Page - ON Semiconductor |
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MC74VHC1G125DFT2 Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 6 page MC74VHC1G125 http://onsemi.com 2 MAXIMUM RATINGS Symbol Characteristics Value Unit VCC DC Supply Voltage −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V VOUT DC Output Voltage VCC = 0 High or Low State −0.5 to 7.0 −0.5 to VCC + 0.5 V IIK Input Diode Current −20 mA IOK Output Diode Current VOUT < GND; VOUT > VCC +20 mA IOUT DC Output Current, per Pin +25 mA ICC DC Supply Current, VCC and GND +50 mA PD Power Dissipation in Still Air SC−88A, TSOP−5 200 mW qJA Thermal Resistance SC−88A, TSOP−5 333 °C/W TL Lead Temperature, 1 mm from Case for 10 s 260 °C TJ Junction Temperature Under Bias +150 °C Tstg Storage Temperature −65 to +150 °C VESD ESD Withstand Voltage Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) > 2000 > 200 N/A V ILatchUp LatchUp Performance Above VCC and Below GND at 125°C (Note 4) $500 mA Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Tested to EIA/JESD22−A114−A. 2. Tested to EIA/JESD22−A115−A. 3. Tested to JESD22−C101−A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit VCC DC Supply Voltage 2.0 5.5 V VIN DC Input Voltage 0.0 5.5 V VOUT DC Output Voltage 0.0 VCC V TA Operating Temperature Range −55 +125 °C tr , tf Input Rise and Fall Time VCC = 3.3 V $ 0.3 V VCC = 5.0 V $ 0.5 V 0 0 100 20 ns/V Device Junction Temperature versus Time to 0.1% Bond Failures Junction Temperature °C Time, Hours Time, Years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 1 1 10 100 1000 TIME, YEARS FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR Figure 3. Failure Rate vs. Time Junction Temperature |
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