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HV5122PJ-G Datasheet(PDF) 11 Page - Microchip Technology |
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HV5122PJ-G Datasheet(HTML) 11 Page - Microchip Technology |
11 / 15 page 2015 Microchip Technology Inc. DS20005418B-page 11 HV5122 / HV5222 44-Lead PLCC Package Outline (PJ) .653x.653in body, .180in height (max), .050in pitch Symbol A A1 A2 b b1 D D1 E E1 e R Dimension (inches) MIN .165 .090 .062 .013 .026 .685 .650 .685 .650 .050 BSC .025 NOM .172 .105 - - - .690 .653 .690 .653 .035 MAX .180 .120 .083 .021 .036† .695 .656 .695 .656 .045 JEDEC Registration MS-018, Variation AC, Issue A, June, 1993. † This dimension differs from the JEDEC drawing. Drawings not to scale. .150 MAX .048/.042 x 45O 1 .075 MAX 6 40 D D1 E1 E Top View Horizontal Side View View B A A2 A1 Seating Plane e b Note 1 (Index Area) .056/.042 x 45 O .020max (3 Places) .020 MIN Vertical Side View View B Note 2 44 b1 Base Plane R Notes: 1. a printed indicator. 2. Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. |
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