4

REF6125, REF6130, REF6133, REF6141, REF6145, REF6150

SBOS747B – MAY 2016 – REVISED AUGUST 2016

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Product Folder Links: REF6125 REF6130 REF6133 REF6141 REF6145 REF6150

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage

–0.3

6

V

–0.3

V

–55

150

°C

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±1000

V

±250

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply input voltage

REF6125

3

5.5

V

REF6130, REF6133, REF6141, REF6145

5.5

REF6150

5.3

5.5

Enable voltage

0

V

Output current

REF6125, REF6130, REF6133, REF6141

–4

4

mA

REF6145

–3.5

3.5

REF6150

–3

3

Operating temperature

–40

25

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

REF61xx

UNIT

DGK (VSSOP)

8 PINS

Junction-to-ambient thermal resistance

158.5

°C/W

Junction-to-case (top) thermal resistance

51.2

°C/W

Junction-to-board thermal resistance

79.5

°C/W

Junction-to-top characterization parameter

5.2

°C/W

Junction-to-board characterization parameter

78.0

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W