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TMS28F800ASB Datasheet(PDF) 1 Page - Texas Instruments |
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TMS28F800ASB Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 52 page  TMS28F008Axy,TMS28F800Axy 1048576 BY 8BIT/524288 BY 16BIT AUTOSELECT BOOT BLOCK FLASH MEMORIES SMJS851A − NOVEMBER 1997 − REVISED MARCH 1998 1 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 D Organization . . . 1048576 By 8 Bits 524 288 By 16 Bits D Array-Blocking Architecture − Two 8K-Byte/4K-Word Parameter Blocks − One 96K-Byte/48K-Word Main Block − Seven 128K-Byte/64K-Word Main Blocks − One 16K-Byte/8K-Word Protected Boot Block − Top or Bottom Boot Locations D All Inputs/Outputs TTL-Compatible D Maximum Access/Minimum Cycle Time 5-V VCC 3-V VCC ’28F008Axy70 70 ns 100 ns ’28F008Axy80 80 ns 120 ns ’28F800Axy70 70 ns 100 ns ’28F800Axy80 80 ns 120 ns (See Table 1 for VCC/VPP Voltage Configuration) D 100000- and 10000-Program/Erase Cycle Versions D Three Temperature Ranges − Commercial ...0 °C to 70°C − Extended ...− 40 °C to 85°C − Automotive ...− 40 °C to 125°C D Embedded Program/Erase Algorithms − Automated Byte Programming − Automated Word Programming − Automated Block Erase − Erase Suspend/Erase Resume D Automatic Power-Saving Mode D JEDEC Standards Compatible − Compatible With JEDEC Byte/Word Pinouts − Compatible With JEDEC EEPROM Command Set D Fully Automated On-Chip Erase and Byte / Word Program Operations D Package Options − 44-Pin Plastic Small-Outline Package (PSOP) (DBJ Suffix) − 40-Pin Thin Small-Outline Package (TSOP) (DCD Suffix) − 48-Pin TSOP (DCD Suffix) − 48-Ball Micro Ball Grid Array ( µBGAt) available D Low Power Dissipation (VCC = 5.5 V) − Active Write . . . 330 mW ( Byte Write) − Active Read ...220 mW ( Byte Read) − Active Write . . . 330 mW ( Word Write) − Active Read ...275 mW ( Word Read) − Block Erase . . . 330 mW − Standby . . . 0.55 mW (CMOS-Input Levels) − Deep Power-Down Mode . . . 0.044 mW D Write-Protection for Boot Block D Industry Standard Command-State Machine (CSM) − Erase Suspend/Resume − Algorithm-Selection Identifier D Flexible VPP/Supply Voltage Combination Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PIN NOMENCLATURE A0 − A18 Address Inputs A0 − A19 Address Inputs (for 40-pin TSOP only) BYTE Byte Enable DQ0 − DQ14 Data In / Out DQ15/A −1 Data In / Out (word-wide mode), Low-Order Address (byte-wide mode) CE Chip Enable OE Output Enable NC No Internal Connection RP Reset / Deep Power Down VCC Power Supply VPP Power Supply for Program / Erase VSS Ground WE Write Enable WP Write Protect (for 40-pin and 48-pin TSOP only) Copyright 1998, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. µBGA is a trademark of Tessera, Inc. |
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