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DAC7664YR Datasheet(PDF) 2 Page - Texas Instruments |
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DAC7664YR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 28 page DAC7664 SBAS271 − MARCH 2004 www.ti.com 2 ORDERING INFORMATION(1) PRODUCT PACKAGE−LEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY DAC7664Y LQFP−64 PM −40 °C to +85°C DAC7664Y DAC7664YT Tape and Reel, 250 DAC7664Y LQFP−64 PM −40 °C to +85°C DAC7664Y DAC7664YR Tape and Reel, 1500 DAC7664YB LQFP−64 PM −40 °C to +85°C DAC7664YB DAC7664YBT Tape and Reel, 250 DAC7664YB LQFP−64 PM −40 °C to +85°C DAC7664YB DAC7664YBR Tape and Reel, 1500 DAC7664YC LQFP−64 PM −40 °C to +85°C DAC7664YC DAC7664YCT Tape and Reel, 250 DAC7664YC LQFP−64 PM −40 °C to +85°C DAC7664YC DAC7664YCR Tape and Reel, 1500 (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) DAC7664 UNIT IOVDD, VCC and VDD to VSS −0.3 to 11 V IOVDD, VCC and VDD to GND −0.3 to 5.5 V Digital Input Voltage to GND −0.3 to VDD + 0.3 V Digital Output Voltage to GND −0.3 to VDD + 0.3 V ESD-CDM 200 V Maximum Junction Temperature +150 °C Operating Temperature Range −40 to +85 °C Storage Temperature Range −65 to +125 °C Lead Temperature (soldering, 10s) +300 °C (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
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