TLV803S datasheet(2/15 Pages) TI1

Part #	TLV803S

Description	3-Pin Voltage Supervisors with Active-Low, Open-Drain Reset

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Manufacturer	TI1 [Texas Instruments]

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TLV803M, TLV803R

TLV803S, TLV803Z

SBVS157A

– APRIL 2011 – REVISED JUNE 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION(1)

SPECIFIED

THRESHOLD

PACKAGE-

PACKAGE

OPERATING

PACKAGE

ORDERING

TRANSPORT MEDIA,

PRODUCT

VOLTAGE

LEAD

DESIGNATOR

TEMPERATURE

MARKING

INFORMATION

QUANTITY

TLV803ZDBZR

Tape and Reel, 3000

TLV803Z

2.25 V

SOT23-3

DBZ

–40°C TO +125°C

VORQ

TLV803ZDBZT

Tape and Reel, 250

TLV803RDBZR

Tape and Reel, 3000

TLV803R

2.64 V

SOT23-3

DBZ

–40°C TO +125°C

VOSQ

TLV803RDBZT

Tape and Reel, 250

TLV803SDBZR

Tape and Reel, 3000

TLV803S

2.93 V

SOT23-3

DBZ

–40°C TO +125°C

VOTQ

TLV803SDBZT

Tape and Reel, 250

TLV803MDBZR

Tape and Reel, 3000

TLV803M

4.38 V

SOT23-3

DBZ

–40°C TO +125°C

VOUQ

TLV803MDBZT

Tape and Reel, 250

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted) .

VALUE

MIN

MAX

UNIT

VDD

(2)

0

7

V

Voltage

All other pins(2)

–0.3

7

V

Maximum low output current, IOL

5

mA

Maximum high output current, IOH

–5

mA

Current

Input clamp current, IIK (VI < 0 or VI > VDD)

±20

mA

Output clamp current, IOK (VO < 0 or VO > VDD)

±20

mA

Operating free-air temperature range, TA

–40

+125

°C

Temperature

Storage temperature range, Tstg

–65

+150

°C

Soldering temperature

+260

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to GND. For reliable operation the device should not be operated at 7 V for more than t = 1000h

continuously

THERMAL INFORMATION

TLV803

THERMAL METRIC(1)

DBZ

UNITS

3 PINS

θJA

Junction-to-ambient thermal resistance

286.9

θJCtop

Junction-to-case (top) thermal resistance

105.6

θJB

Junction-to-board thermal resistance

124.4

°C/W

ψJT

Junction-to-top characterization parameter

25.8

ψJB

Junction-to-board characterization parameter

107.9

θJCbot

Junction-to-case (bottom) thermal resistance

—

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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Product Folder Link(s): TLV803M TLV803R TLV803S TLV803Z

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