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TPS73230DBVR Datasheet(PDF) 3 Page - Texas Instruments |
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TPS73230DBVR Datasheet(HTML) 3 Page - Texas Instruments |
3 / 18 page www.ti.com ABSOLUTE MAXIMUM RATINGS POWER DISSIPATION RATINGS (1) TPS73201, TPS73215, TPS73216 TPS73218, TPS73225, TPS73230 TPS73233, TPS73250 SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004 over operating junction temperature range unless otherwise noted(1) TPS732xx UNIT VIN range -0.3 to 6.0 V VEN range -0.3 to 6.0 V VOUT range -0.3 to 5.5 V Peak output current Internally limited Output short-circuit duration Indefinite Continuous total power dissipation See Dissipation Ratings Table Junction temperature range, TJ -55 to +150 °C Storage temperature range -65 to +150 °C ESD rating, HBM 2 kV ESD rating, CDM 500 V (1) Stresses beyond those listedunder absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings only, andfunctional operation of the device at these or any other conditions beyondthose indicated under the Electrical Characteristics is not implied. Exposureto absolute maximum rated conditions for extended periods may affect devicereliability. DERATING FACTOR TA ≤ 25°C TA = 70°C TA = 85°C BOARD PACKAGE RΘJC RΘJA ABOVE TA = 25°C POWER RATING POWER RATING POWER RATING Low-K(2) DBV 64 °C/W 255 °C/W 3.9mW/ °C 390mW 215mW 155mW High-K (3) DBV 64 °C/W 180 °C/W 5.6mW/ °C 560mW 310mW 225mW Low-K(2) DCQ 15 °C/W 53 °C/W 18.9mW/ °C 1.89W 1.04W 0.76W (1) SeePower Dissipation in theApplications section formore information related to thermal design. (2) The JEDEC Low-K (1s) boarddesign used to derive this data was a 3 inch x 3 inch, two-layer board with2-ounce copper traces on top of the board. (3) The JEDEC High-K (2s2p)board design used to derive this data was a 3 inch x 3 inch, multilayer boardwith 1-ounce internal power and ground planes and 2-ounce copper traces on thetop and bottom of the board. 3 |
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