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THS3091D Datasheet(PDF) 2 Page - Texas Instruments |
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THS3091D Datasheet(HTML) 2 Page - Texas Instruments |
2 / 31 page www.ti.com D, DDA TOP VIEW 1 2 3 4 8 7 6 5 NC VIN− VIN+ VS− NC VS+ VOUT NC NC = No Internal Connection THS3091 Note A: The devices with the power−down option defaults to the ON state if no signal is applied to the PD pin. Additionallly, the REF pin functional range is from VS− to (VS+ − 4 V). 1 2 3 4 8 7 6 5 REF VIN − VIN + VS− PD VS+ VOUT NC D, DDA TOP VIEW THS3095 NC = No Internal Connection See Note A. DISSIPATION RATING TABLE THS3091 THS3095 SLOS423C – SEPTEMBER 2003 – REVISED AUGUST 2004 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ODERING INFORMATION PART NUMBER PACKAGE TYPE TRANSPORT MEDIA, QUANTITY THS3091D Rails, 75 SOIC-8 THS3091DR Tape and Reel, 2500 THS3091DDA Rails, 75 SOIC-8-PP(1) THS3091DDAR Tape and Reel, 2500 Power-down THS3095D Rails, 75 SOIC-8 THS3095DR Tape and Reel, 2500 THS3095DDA Rails, 75 SOIC-8-PP(1) THS3095DDAR Tape and Reel, 2500 (1) The PowerPAD is electrically isolated from all other pins. POWER RATING (2) TJ = 125°C PACKAGE Θ JC (°C/W) Θ JA (°C/W) (1) TA = 25°C TA = 85°C D-8 38.3 97.5 1.02 W 410 mW DDA-8(3) 9.2 45.8 2.18 W 873 mW (1) This data was taken using the JEDEC standard High-K test PCB. (2) Power rating is determined with a junction temperature of 125 °C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125 °C for best performance and long-term reliability. (3) The THS3091 and THS3095 may incorporate a PowerPAD™ on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD™ thermally enhanced package. 2 |
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