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UCC28811DG4 Datasheet(PDF) 3 Page - Texas Instruments |
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UCC28811DG4 Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 34 page  PACKAGE DISSIPATION RATINGS (1) UCC28810 UCC28811 www.ti.com.............................................................................................................................................................................................. SLUS865 – OCTOBER 2008 PACKAGE THERMAL IMPEDANCE JUNCTION-TO-AMBIENT (°C/W) Plastic 8-Pin Small Outline 150 (1) TI device packages are modeled and tested for thermal performance using printed circuit board designs outlined in JEDEC standards JESD 51-3 and JESD 51-7. Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): UCC28810 UCC28811 |
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