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UCC21520ADWR Datasheet(PDF) 7 Page - Texas Instruments |
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UCC21520ADWR Datasheet(HTML) 7 Page - Texas Instruments |
7 / 45 page 7 UCC21520 www.ti.com SLUSCJ9A – JUNE 2016 – REVISED JUNE 2016 Product Folder Links: UCC21520 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated 6.7 Safety-Related Certifications VDE CSA UL CQC Certified according to DIN VDE V 0884-10 (VDE V 0884-10):2006- 12 and DIN EN 60950-1 (VDE 0805 Teil 1):2011- 01 Approved under CSA Component Acceptance Notice 5A, IEC 60950-1 and IEC 60601-1 Certified according to UL 1577 Component Recognition Program Certified according to GB 4943.1- 2011 Reinforced Insulation Maximum Transient Isolation voltage, 8000 VPK; Maximum Repetitive Peak Isolation Voltage, 2121 VPK; Maximum Surge Isolation Voltage, 8000 VPK Reinforced insulation per CSA 60950-1- 07+A1+A2 and IEC 60950-1 2nd Ed. Single protection, 5700 VRMS Reinforced Insulation, Altitude ≤ 5000 m, Tropical Climate Agency Qualification Planned Agency Qualification Planned File number: E181974 Agency Qualification Planned 6.8 Safety-Limiting Values Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures. PARAMETER TEST CONDITIONS SIDE MIN TYP MAX UNIT IS Safety output supply current RθJA = 78.1ºC/W, VDDA/B = 12 V, TA = 25°C, TJ = 150°C See Figure 2 DRIVER A, DRIVER B 64 mA RθJA = 78.1ºC/W, VDDA/B = 25 V, TA = 25°C, TJ = 150°C DRIVER A, DRIVER B 31 mA PS Safety supply power RθJA = 78.1ºC/W, TA = 25°C, TJ = 150°C See Figure 3 INPUT 50 mW DRIVER A 775 DRIVER B 775 TOTAL 1600 TS Safety temperature 150 °C The maximum safety temperature is the maximum junction temperature specified for the device. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed on a High-K test board for leaded surface mount packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. |
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