TLV27L1

TLV27L2

SLOS378B − SEPTEMBER 2001 − REVISED MARCH 2012

11

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APPLICATION INFORMATION

general power dissipation considerations

PD +

TMAX–TA

qJA

Where:

= Maximum power dissipation of TLV27Lx IC (watts)

= Free-ambient air temperature (°C)

1

0.75

0.5

0

−55 −40 −25 −10 5

1.25

1.5

MAXIMUM POWER DISSIPATION

vs

FREE-AIR TEMPERATURE

1.75

20 35 50

0.25

2

65 80 95 110 125

MSOP Package

Low-K Test PCB

PDIP Package

Low-K Test PCB

SOIC Package

Low-K Test PCB

SOT-23 Package

Low-K Test PCB

NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.

Figure 28. Maximum Power Dissipation vs Free-Air Temperature

3

2

4

5

(TOP VIEW)

1

OUT

GND

IN+

IN −

TLV27L1

DBV PACKAGE

1

2

3

4

8

7

6

5

NC

IN−

IN+

GND

NC

OUT

NC

TLV27L1

D PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

1OUT

1IN−

1IN+

GND

2OUT

2IN−

2IN+

TLV27L2

D PACKAGE

(TOP VIEW)

NC − No internal connection