TLV2381

TLV2382

SLOS377A – SEPTEMBER 2001– REVISED JULY 2003

11

www.ti.com

APPLICATION INFORMATION

general power dissipation considerations

For a given

P

D +

T

MAX

–T

A

q

JA

Where:

= Maximum power dissipation of TLV238x IC (watts)

= Free-ambient air temperature (

°C)

1

0.75

0.5

0

–55 –40 –25 –10 5

1.25

1.5

MAXIMUM POWER DISSIPATION

vs

FREE-AIR TEMPERATURE

1.75

20 35 50

0.25

TA – Free-Air Temperature – °C

2

65 80 95 110 125

MSOP Package

Low-K Test PCB

θJA = 260°C/W

TJ = 150°C

PDIP Package

Low-K Test PCB

θJA = 104°C/W

SOIC Package

Low-K Test PCB

θJA = 176°C/W

SOT-23 Package

Low-K Test PCB

θJA = 324°C/W

NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.

Figure 28. Maximum Power Dissipation vs Free-Air Temperature

3

2

4

5

(TOP VIEW)

1

OUT

GND

IN+

VDD

IN –

TLV2381

DBV PACKAGE

1

2

3

4

8

7

6

5

NC

IN –

IN +

GND

NC

OUT

NC

TLV2381

D PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

1OUT

1IN –

1IN +

GND

2OUT

2IN –

2IN+

TLV2382

D PACKAGE

(TOP VIEW)

NC – No internal connection