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TLK2201BRCP Datasheet(PDF) 10 Page - Texas Instruments |
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TLK2201BRCP Datasheet(HTML) 10 Page - Texas Instruments |
10 / 24 page www.ti.com ABSOLUTE MAXIMUM RATINGS (1) DISSIPATION RATINGS (1) THERMAL CHARACTERISTICS TLK2201B TLK2201BI SLLS585C – NOVEMBER 2003 – REVISED FEBRUARY 2008 over operating free-air temperature range (unless otherwise noted) VALUE UNIT VDD Supply voltage(2) –0.3 to 3 V VI Input voltage range at TTL terminals –0.5 to 4 V Input voltage range at any other terminal –0.3 to VDD +0.3 V Tstg Storage temperature –65 to 150 °C CDM 1 kV Electrostatic discharge HDM 2 kV TLK2201B 0 to 70 °C Characterized free-air operating temperature range TLK2201BI –40 to 85 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. OPERATING TA ≤ 25°C TA = 70 °C PACKAGE FACTOR(2) POWER RATING POWER RATING ABOVE TA = 25°C RCP64(3) 5.25 W 46.58 mW/ °C 2.89 W RCP64(4) 3.17 W 23.70 mW/ °C 1.74 W RCP64(5) 2.01 W 13.19 mW/ °C 1.11 W (1) For more information, refer to TI application note PowerPAD Thermally Enhanced Package (SLMA002). (2) This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA). (3) 2 oz. Trace and copper pad with solder. (4) 2 oz. Trace and copper pad without solder. (5) Standard JEDEC high-K board PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Board-mounted, no air flow, high conductivity TI recommended test board, chip soldered or greased 21.47 to thermal land RθJA Junction-to-free-air thermal resistance Board-mounted, no air flow, high conductivity TI °C/W recommended test board with thermal land but no 42.20 solder or grease thermal connection to thermal land Board-mounted, no air flow, JEDEC test board 75.83 Board-mounted, no air flow, high conductivity TI recommended test board, chip soldered or greased 0.38 to thermal land RθJC Junction-to-case-thermal resistance Board-mounted, no air flow, high conductivity TI °C/W recommended test board with thermal land but no 0.38 solder or grease thermal connection to thermal land Board-mounted, no air flow, JEDEC test board 7.8 10 Submit Documentation Feedback Copyright © 2003–2008, Texas Instruments Incorporated Product Folder Link(s): TLK2201B TLK2201BI |
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