Electronic Components Datasheet Search |
|
TLV2211Y Datasheet(PDF) 3 Page - Texas Instruments |
|
TLV2211Y Datasheet(HTML) 3 Page - Texas Instruments |
3 / 31 page SLOS156E − MAY 1996 − REVISED SEPTEMBER 2006 TLV2211, TLV2211Y Advanced LinCMOS RAILTORAIL MICROPOWER SINGLE OPERATIONAL AMPLIFIERS 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLV2211Y chip information This chip, when properly assembled, displays characteristics similar to the TLV2211C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 10 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (2) IS INTERNALLY CONNECTED TO BACK SIDE OF CHIP. + − OUT IN + IN − VDD + (5) (1) (3) (4) (2) VDD −/ GND 40 (3) (2) (1) (5) (4) 32 |
Similar Part No. - TLV2211Y |
|
Similar Description - TLV2211Y |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |