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TLV379, TLV2379, TLV4379

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SBOS785 – APRIL 2016

Product Folder Links: TLV379 TLV2379 TLV4379

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Copyright © 2016, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information: TLV379

TLV379

UNIT

DCK (SC70)

DBV (SOT23)

D (SOIC)

5 PINS

5 PINS

8 PINS

Junction-to-ambient thermal resistance

262.2

220.8

130.8

°C/W

Junction-to-case (top) thermal resistance

99.7

148.3

77.2

°C/W

Junction-to-board thermal resistance

49.0

48.2

71.1

°C/W

Junction-to-top characterization parameter

3.3

28.6

30.7

°C/W

Junction-to-board characterization parameter

18.2

47.3

70.6

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.5 Thermal Information: TLV2379

TLV2379

UNIT

D (SOIC)

8 PINS

Junction-to-ambient thermal resistance

116.4

°C/W

Junction-to-case (top) thermal resistance

59.5

°C/W

Junction-to-board thermal resistance

57.6

°C/W

Junction-to-top characterization parameter

17.2

°C/W

Junction-to-board characterization parameter

57.0

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.6 Thermal Information: TLV4379

TLV4379

UNIT

PW (TSSOP)

14 PINS

Junction-to-ambient thermal resistance

110.8

°C/W

Junction-to-case (top) thermal resistance

35.2

°C/W

Junction-to-board thermal resistance

53.6

°C/W

Junction-to-top characterization parameter

2.6

°C/W

Junction-to-board characterization parameter

52.9

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W