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TLV2313IDGKR Datasheet(PDF) 1 Page - Texas Instruments

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Part # TLV2313IDGKR
Description  Low-Power, Rail-to-Rail In/Out, 500-muV Typical Offset, 1-MHz Operational Amplifier for Cost-Sensitive Systems
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLV2313IDGKR Datasheet(HTML) 1 Page - Texas Instruments

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60
65
70
75
80
85
90
95
100
105
110
-50
-25
0
25
50
75
100
125
Temperature (oC)
C001
PSRR
CMRR
V
CM = ±0.2 V to 5.2 V
Product
Folder
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Buy
Technical
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TLV313, TLV2313, TLV4313
SBOS753A – JUNE 2016 – REVISED JUNE 2016
TLVx313 Low-Power, Rail-to-Rail In/Out, 500-µV Typical Offset,
1-MHz Operational Amplifier for Cost-Sensitive Systems
1
1 Features
1
Precision Amplifier for Cost-Sensitive Systems
Low IQ: 65 µA/ch
Wide Supply Range: 1.8 V to 5.5 V
Low Noise: 26 nV/
√Hz at 1 kHz
Gain Bandwidth: 1 MHz
Rail-to-Rail Input/Output
Low Input Bias Current: 1 pA
Low Offset Voltage: 0.75 mV
Unity-Gain Stable
Internal RF/EMI Filter
Extended Temperature Range:
–40°C to +125°C
2 Applications
Medical and Healthcare
Fitness and Wearable Electronics
Utility Metering (Heat, Water, Energy)
Building Automation Equipment
Currency Counters
CMRR and PSRR vs Temperature
3 Description
The TLV313 family of single-, dual-, and quad-
channel precision operational amplifiers combine low
power consumption with good performance. This
makes them suitable for a wide range of applications,
such
as
wearables,
utility
metering,
building
automation, currency counters and more. The family
features rail-to-rail input and output (RRIO) swings,
low
quiescent
current
(65
μA,
typical),
wide
bandwidth (1 MHz) and very low noise (26 nV/
√Hz at
1 kHz), making it attractive for a variety of battery-
powered applications that require a good balance
between cost and performance. Further, low-input-
bias current enables these devices to be used in
applications with megaohm source impedances.
The robust design of the TLV313 devices provides
ease-of-use to the circuit designer: unity-gain stability
with capacitive loads of up to 150 pF, integrated
RF/EMI rejection filter, no phase reversal in overdrive
conditions, and high electrostatic discharge (ESD)
protection (4-kV HBM).
The devices are optimized for operation at voltages
as low as +1.8 V (±0.9 V) and up to +5.5 V (±2.75 V),
and are specified over the extended temperature
range of –40°C to +125°C.
The single-channel TLV313 device is available in
both SC70-5 and SOT23-5 packages. The dual-
channel TLV2313 device is offered in SOIC-8 and
VSSOP-8 packages, and the quad-channel TLV4313
device is offered in a TSSOP-14 package.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TLV313
SC70 (5)
2.00 mm × 1.25 mm
SOT23 (5)
2.90 mm × 1.60 mm
TLV2313
SOIC (8)
4.90 mm × 3.91 mm
VSSOP (8)
3.00 mm × 3.00 mm
TLV4313
TSSOP (14)
5.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.


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