Specifications subject to change without notice.

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Chip Inductors – 0402DF (1005)

Document 1069-1

Document 1069-1 07/29/15

Impedance typ (Ohms)

±5% (nH)

900 MHz

1.7 GHz

(MHz)

(Ohms)

(mA)

0402DF-200XJR_

20

90

150

2950

0.049

1400

0402DF-360XJR_

36

150

250

2400

0.055

1300

0402DF-560XJR_

56

250

480

2200

0.061

1200

0402DF-770XJR_

77

350

580

2050

0.072

1100

0402DF-900XJR_

90

400

600

2300

0.079

1000

0402DF-101XJR_

105

530

1000

1660

0.104

850

0402DF-121XJR_

120

515

900

2000

0.090

950

0402DF-141XJR_

140

650

1075

1450

0.141

750

0402DF-151XJR_

150

700

1170

1800

0.130

830

0402DF-181XJR_

180

850

1460

1680

0.172

730

0402DF-221XJR_

220

1100

2050

1560

0.240

600

0402DF-271XJR_

270

1300

2150

1480

0.265

590

0402DF-301XJR_

300

1725

2630

1400

0.340

490

0402DF-331XJR_

330

2100

2750

1340

0.435

430

0402DF-361XJR_

360

2150

3100

1200

0.475

420

0402DF-421XJR_

420

2175

3350

1100

0.510

400

0402DF-471XJR_

470

2550

3670

1070

0.670

340

0402DF-531XJR_

530

3950

3050

1000

0.715

330

0402DF-591XJR_

590

4770

3090

960

0.780

320

0402DF-701XJR_

700

5750

1830

600

1.30

230

0402DF-771XJR_

770

4900

1800

585

1.35

220

0402DF-901XJR_

900

7130

4470

760

1.50

230

0402DF-102XJR_

1000

280

180

235

1.05

190

0402DF-222XJR_

2200

200

120

125

1.80

170

0402DF-332XJR_

3300

160

80

80

2.20

150

• Higher inductance values than other 0402 inductors

• Ferrite construction for high current handling

• 25 inductance values from 20 nH to 3.3 µH

• Ideal for use in both mobile and infrastructure equipment

• Equally effective on-board or modular

• Developed for use in cellular applications:

As a filter element in bandstop and low pass filters

As a one pole filter or RF choke in cellular bands

• Can also be used for ground-to-ground isolation

1. When ordering, please specify

termination and packaging codes:

0402DF-771XJRW

Termination: R = RoHS compliant matte tin over nickel over silver-

platinum-glass frit.

Special order:

Q = RoHS tin-silver-copper (95.5/4/0.5)

or

P = non-RoHS tin-lead (63/37).

Packaging: W= 7

″ machine-ready reel. EIA-481 punched paper

tape (2000 parts per full reel).

U = Less than full reel. In tape, but not machine ready.

To have a leader and trailer added ($25 charge),

use code letter W instead.

2. Inductance measured at 7.9 MHz using a Coilcraft SMD-F test fixture

and Coilcraft-provided correlation pieces with an Agilent/HP 4286

impedance analyzer.

3. SRF measured using Agilent/HP 8753D network analyzer and Coilcraft

SMD-D test fixture.

4. DCR measured on Cambridge Technology micro-ohmmeter and a

Coilcraft CCF858 test fixture.

5. Current that causes a 15°C temperature rise from 25°C ambient.

Because of their open construction, these parts will not saturate.

Refer to Doc 362 “Soldering Surface Mount Components” before soldering.

Core material Ferrite

Environmental RoHS compliant without exemption, halogen free

Terminations RoHS compliant matte tin over nickel over silver-platinum-

glass frit.

Weight 0.9 – 1.1 mg

Ambient temperature –40°C to +85°C with

Irms current

Maximum part temperature +100°C (Ambient + temperature rise)

Storage temperature Component: –40°C to +100°C.

Tape and reel packaging: –40°C to +80°C

Resistance to soldering heat Max three 40 second reflows at

+260°C, parts cooled to room temperature between cycles

Temperature Coefficient of Inductance (TCL) +25 to +150 ppm/°C

Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /

85% relative humidity)

Failures in Time (FIT) / Mean Time Between Failures (MTBF)

One per billion hours / one billion hours, calculated per Telcordia SR-332

Packaging 2000 per 7

″ reel. Paper tape: 8 mm wide, 0.68 mm thick,

2 mm pocket spacing

PCB washing Tested to MIL-STD-202 Method 215 plus an additional

aqueous wash. See Doc787_PCB_Washing.pdf.