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TLC532AM Datasheet(PDF) 9 Page - Texas Instruments

Part # TLC532AM
Description  LinCMOSE 8-BIT ANALOG-TO-DIGITAL PERIPHERALS WITH 5 ANALOG AND 6 DUAL-PURPOSE INPUTS
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLC532AM Datasheet(HTML) 9 Page - Texas Instruments

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TLC532AI, TLC532AM
LinCMOS
™ 8-BIT ANALOG-TO-DIGITAL PERIPHERALS
WITH 5 ANALOG AND 6 DUAL-PURPOSE INPUTS
SLAS070 – D2819, NOVEMBER 1983 – REVISED SEPTEMBER 1986
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
9
electrical characteristics over recommended ranges VCC, VREF+, and operating free-air
temperature, VREF– at ground, fCLK = 1.048 MHz (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP†
MAX
UNIT
VOH
High-level output voltage
IOH = – 1.6 mA
2.4
V
VOL
Low-level output voltage
IOL = 1.6 mA
0.4
V
IIH
High level input current
Any digital or Clock input
VIH =5 5V
10
µA
IIH
High-level input current
Any control input
VIH = 5.5 V
1
µA
IIL
Low level input current
Any digital or Clock input
VIL =0
– 10
µA
IIL
Low-level input current
Any control input
VIL = 0
– 1
µA
IOZ
Off state (high impdance state) output current
VO = VCC
10
µA
IOZ
Off-state (high-impdance state) output current
VO = 0
– 10
µA
II
Analog input current (see Note 3)
VI = 0 to VCC
±500
nA
Leakage current between selected channel
and all other analog channels
VI = 0 to VCC,
Clock input at 0 V
±400
nA
Ci
Input capacitance
Digital pins 3 thru 10
4
30
pF
Ci
Input capacitance
Any other input pin
2
15
pF
ICC + IREF+ Supply current plus reference current
VCC = VREF+ = 5.5 V,
Outputs open
1.5
3
mA
ICC
Supply current
VCC = 5.5 V
1.2
2
mA
NOTE 3: Analog input current is an average of the current flowing into a selected analog channel input during one full conversion cycle.
operating chacteristics over recommended operating free-air temperature range, VREF+ = VCC,
VREF– at ground, fCLK = 1.048 MHz (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP†
MAX
UNIT
Linearity error (see Note 4)
±0.5
LSB
Zero error (see Note 5)
±0.5
LSB
Full-scale error (see Note 5)
±0.5
LSB
Total unadjusted error (see Note 6)
±0.5
LSB
Absolute accuracy error (see Note 7)
±1
LSB
tconv
Conversion time (including channel acquisition time)
30
Clock
Cycles
tacq
Channel acquisition time prior to starting conversion
10
Clock
Cycles
ten
Data output enable time See Note 8
CL = 50 pF, RL = 3 kΩ
335
ns
tdis
Data output disable time
CL = 50 pF, RL = 3 kΩ
10
ns
t (bus)
Data bus output rise time
High-impedance to high level
CL =50 pFRL =3kΩ
150
ns
tr(bus) Data bus output rise time
Low-to-high level
CL = 50 pF, RL = 3 kΩ
300
ns
tf(bus) Data bus output fall time
High-impedance to low level
CL =50 pFRL =3kΩ
150
ns
tf(bus) Data bus output fall time
High-to-low level
CL = 50 pF, RL = 3 kΩ
300
ns
† Typical values are at VCC = 5 V, TA = 25°C.
NOTES: 4
Linearity error is the deviation from the best straight line through the A/D transfer characteristics.
5
Zero error is the difference between 00000000 and the converted output for zero input voltage; full-scale error is the difference between
11111111 and the converted output for full-scale input voltage.
6
Total unadjusted error is the sum of liinearity, zero, and full-scale errors.
7
Absolute accuracy error is the maximum difference between an analog value and the nominal midstep value within any step. This
includes all errors including inherent quantization error, which is the
±0.5 LSB uncertainty caused by the A/D converters’ finite
resolution.
8
If chip-select setup time, tsu(CS), is less than 0.14 µs, the effective data output enable time, ten, may extend such that tsu(CS) + ten is
equal to a maximum of 0.475
µs.


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