LP2952-N, LP2952A, LP2953, LP2953A

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SNVS095F – MAY 2004 – REVISED MARCH 2015

6.4 Thermal Information

LP2952, LP2953

LP2953

SOIC (D)

PDIP (NBG)

UNIT

16 PINS

Junction-to-ambient thermal resistance

76.9

42.1

Junction-to-case (top) thermal resistance

37.4

28.1

Junction-to-board thermal resistance

34.6

22.2

°C/W

Junction-to-top characterization parameter

7.3

12.0

Junction-to-board characterization parameter

34.3

22.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics: 3.3-V Versions

Limits are assured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.

Unless otherwise specified: MIN (minimum) and MAX (maximum) specifications in apply over the full Operating Temperature

μF for 3.3-V parts. FEEDBACK pin is tied to VTAP pin, OUT pin is tied to SENSE pin.

LP2952AI-3.3, LP2953AI-3.3

LP2952I-3.3, LP2953I-3.3

PARAMETER

TEST CONDITIONS

UNIT

MIN

TYP

MAX

MIN

TYP

MAX

3.284

3.3

3.317

3.267

3.3

3.333

Output voltage

3.260

3.3

3.340

3.234

3.3

3.366

V

1 mA

3.254

3.3

3.346

3.221

3.3

3.379

6.6 Electrical Characteristics: 5-V Versions

Limits are assured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.

Unless otherwise specified, MIN (minimum) and MAX (maximum) specifications in apply over the full Operating Temperature

μF for 3.3-V parts. FEEDBACK pin is tied to VTAP pin, OUT pin is tied to SENSE pin.

LP2952AI, LP2953AI

LP2952I, LP2953I

PARAMETER

TEST CONDITIONS

UNIT

MIN

TYP

MAX

MIN

TYP

MAX

4.975

5

5.025

4.95

5

5.05

Output voltage

4.94

5

5.06

4.9

5

5.1

V

1 mA

4.93

5

5.07

4.88

5

5.12

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