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SENSOR

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Active Band-Pass Filter

High Impedance Sensor Interface

CMOS Input Feature

High-Side, Current-Sensing

Rail-to-Rail Input and Output Feature

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LMV841, LMV842, LMV844

LMV841-Q1, LMV842-Q1, LMV844-Q1

SNOSAT1H – OCTOBER 2006 – REVISED JULY 2016

LMV84x CMOS Input, RRIO, Low Power, Wide Supply Range, 4.5-MHz Operational

Amplifiers

1

1 Features

1

•

AEC-Q100 Automotive Qualification Test

Guidance With the Following:

–

Device Temperature Grade 1: –40°C to

+125°C Ambient Operating Temperature

–

Device HBM ESD Classification Level 2

–

Device CDM ESD Classification Level C3

•

Unless Otherwise Noted, Typical Values at

•

Small 5-Pin SC70 Package (2.00 mm × 1.25 mm

× 0.95 mm)

•

Wide Supply Voltage Range: 2.7 V to 12 V

•

Specified Performance at 3.3 V, 5 V and ±5 V

•

Low Supply Current: 1 mA Per Channel

•

Unity Gain Bandwidth: 4.5 MHz

•

Open-Loop Gain: 133 dB

•

Input Offset Voltage: 500 µV Maximum

•

Input Bias Current: 0.3 pA

•

CMRR at 112 dB and PSSR at 108 dB

•

Input Voltage Noise: 20 nV/

√Hz

•

Temperature Range:

−40°C to 125°C

•

Rail-to-Rail Input and Output (RRIO)

2 Applications

•

High Impedance Sensor Interface

•

Battery-Powered Instrumentation

•

High Gain and Instrumentation Amplifiers

•

DAC Buffers and Active Filters

3 Description

The LMV84x devices are low-voltage and low-power

operational

amplifiers

that

operate

with

supply

voltages ranging from 2.7 V to 12 V and have rail-to-

rail input and output capability. Their low offset

voltage, low supply current, and CMOS inputs make

them ideal for high impedance sensor interface and

battery-powered applications.

The single LMV841 is offered in the space-saving 5-

Pin SC70 package, the dual LMV842 in the 8-Pin

VSSOP and 8-Pin SOIC packages, and the quad

LMV844 in the 14-Pin TSSOP and 14-Pin SOIC

packages. These small packages are ideal solutions

for area-constrained PCBs and portable electronics.

The

LMV841-Q1,

LMV842-Q1,

and

LMV844-Q1

incorporate enhanced manufacturing and support

processes for the automotive market, including defect

detection methodologies.

Reliability

qualification

is

compliant

with

the

requirements and temperature grades defined in the

AEC-Q100 standard.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE (NOM)

LMV841

SC70 (5)

2.00 mm × 1.25 mm

LMV842

VSSOP (8)

3.00 mm × 3.00 mm

SOIC (8)

4.90 mm × 3.91 mm

LMV844

SOIC (14)

8.65 mm × 3.91 mm

TSSOP (14)

5.00 mm × 4.40 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Typical Applications