THS7374

SLOS590B – JULY 2008 – REVISED JANUARY 2011

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

PACKAGE-LEAD

TRANSPORT MEDIA, QUANTITY

THS7374IPW

Rails, 90

TSSOP-14

Pb-Free, Green

THS7374IPWR

Tape and Reel, 2000

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

These packages conform to Lead (Pb)-free and green manufacturing specifications. Additional details including specific material content

can be accessed at www.ti.com/leadfree.

GREEN: TI defines Green to mean Lead (Pb)-Free and in addition, uses less package materials that do not contain halogens, including

bromine (Br), or antimony (Sb) above 0.1% of total product weight. N/A: Not yet available Lead (Pb)-Free; for estimated conversion

dates, go to www.ti.com/leadfree. Pb-FREE: TI defines Lead (Pb)-Free to mean RoHS compatible, including a lead concentration that

does not exceed 0.1% of total product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering

processes.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range unless otherwise noted.

THS7374

UNIT

5.5

V

V

100

mA

Continuous power dissipation

See Dissipation Ratings Table

+150

°C

Maximum junction temperature, continuous operation, long-term

+125

°C

–65 to +150

°C

Human body model (HBM)

2000

V

ESD ratings

Charged device model (CDM)

1000

V

Machine model (MM)

200

V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.

(3)

The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this

temperature may result in reduced reliability and/or lifetime of the device.

DISSIPATION RATINGS

PACKAGE

(°C/W)

(°C/W)

POWER RATING

POWER RATING

TSSOP-14 (PW)

35

115

870 mW

348 mW

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

3

5

V

–40

+85

°C

2

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