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LP2995MX Datasheet(PDF) 10 Page - Texas Instruments |
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LP2995MX Datasheet(HTML) 10 Page - Texas Instruments |
10 / 24 page LP2995 + + VTT PVIN VDDQ VREF GND AVIN VSENSE VDDQ VDD VTT VREF COUT CIN 0 100 200 300 400 500 600 AIRFLOW (Linear Feet Per Minute) 45 46 47 48 49 50 51 0 1 2 3 4 NUMBER OF VIAS 40 50 60 70 80 90 100 LP2995 SNVS190M – FEBRUARY 2002 – REVISED MARCH 2013 www.ti.com Figure 15. WQFN-16 θJA vs # of Vias (4 Layer JEDEC Board)) Additional improvements in lowering the θJA can also be achieved with a constant airflow across the package. Maintaining the same conditions as above and utilizing the 2x2 via array, Figure 16 shows how the θJA varies with airflow. Figure 16. θJA vs Airflow Speed (JEDEC Board with 4 Vias) Typical Application Circuits The typical application circuit used for SSTL-2 termination schemes with DDR-SDRAM can be seen in Figure 17. Figure 17. SSTL-2 Implementation 10 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LP2995 |
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