THS6032

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

VALUE

UNIT

33

V

Input voltage

800

mA

Differential input voltage

±4

V

Maximum junction temperature

+150

°C

C-suffix

0 to +70

°C

Operating free-air temperature

I-suffix

–40 to +85

°C

Storage temperature

–65 to +150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

(3)

The THS6032 incorporates a PowerPAD on the underside of the chip. This acts as a heat sink and must be connected to a

thermally-dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature

thermally-enhanced packages.

DISSIPATION RATINGS

(1)

PACKAGE

(°C/W)

(°C/W)

POWER RATING

DWP

21.5

0.37

5.8 W

GQE

37.8

4.56

3.3 W

VFP

30

1.2

4.1 W

(1)

This data was taken using 2 oz. trace and copper pad that is soldered directly to a JEDEC standard 4

layer 3 in × 3 in PCB.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

±3

±5

Supply voltage

0

0

0

V

±5

±15

±16

C-suffix

0

+70

Operating free-air temperature

°C

I-suffix

–40

+85

Copyright © 1999–2009, Texas Instruments Incorporated

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Product Folder Link(s): THS6032