THS4061, THS4062

180MHz HIGHSPEED AMPLIFIERS

SLOS234E − DECEMBER 1998 − REVISED DECEMBER 2003

3

POST OFFICE BOX 655303

33 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

150 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±4 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation

See Dissipation Rating Table

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0

°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

I-suffix

−40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

M-suffix

−55

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds, D and DGN package

300

°C

. . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds, JG package

300

°C

. . . . . . . . . . . . . . . . . . . .

Case temperature for 60 seconds, FK package

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DISSIPATION RATING TABLE

PACKAGE

TA ≤ 25°C

DERATING FACTOR

TA = 70°C

TA = 85°C

TA = 125°C

PACKAGE

TA ≤ 25 C

POWER RATING

DERATING FACTOR

ABOVE TA = 25°C

TA = 70 C

POWER RATING

TA = 85 C

POWER RATING

TA = 125 C

POWER RATING

D

740 mW

6 mW/

°C

475 mW

385 mW

—

DGN‡

2.14 W

17.1 mW/

°C

1.37 W

1.11 W

—

JG

1057 mW

8.4 mW/

°C

627 mW

546 mW

210 mW

FK

1375 mW

11 mW/

°C

880 mW

715 mW

275 mW

‡ The DGN package incorporates a PowerPAD on the underside of the device. This acts as a heatsink and must be connected to a thermal dissipation

plane for proper power dissipation. Failure to do so can result in exceeding the maximum specified junction temperature, which could permanently

damage the device.

recommended operating conditions

MIN

NOM

MAX

UNIT

Supply voltage, VCC+ and VCC−

Dual supply

±4.5

±16

V

Supply voltage, VCC+ and VCC−

Single supply

9

32

V

C-suffix

0

70

Operating free-air temperature, TA

I-suffix

−40

85

°C

Operating free-air temperature, TA

M-suffix

−55

125

C