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THS4031CDGN Datasheet(PDF) 3 Page - Texas Instruments |
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THS4031CDGN Datasheet(HTML) 3 Page - Texas Instruments |
3 / 47 page 3 THS4031, THS4032 www.ti.com SLOS224H – JULY 1999 – REVISED JUNE 2016 Product Folder Links: THS4031 THS4032 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated (1) For the most current package and ordering information, see Mechanical, Packaging, and Orderable Information, or see the TI web site at www.ti.com. (2) The D and DGN packages are available taped and reeled. Add an R suffix to the device type (that is, THS4031CDGNR). (3) The PowerPAD™ on the underside of the DGN package is electrically isolated from all other pins and active circuitry. Connection to the PCB ground plane is recommended, although not required, as this copper plane is typically the largest copper plane on the PCB. 5 Device Comparison Table Table 1. Available Options(1) TA NUMBER OF CHANNELS PACKAGED DEVICES EVALUATION MODULE PLASTIC SMALL OUTLINE(2) (D) PLASTIC MSOP(2)(DGN)(3) DEVICE SYMBOL 0°C to 70°C 1 THS4031CD THS4031CDGN TIACM THS4031EVM 2 THS4032CD THS4032CDGN TIABD THS4032EVM –40°C to 85°C 1 THS4031ID THS4031IDGN TIACN — 2 THS4032ID THS4032IDGN TIABG — –55°C to 125°C 1 — — — — |
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