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THS3061D Datasheet(PDF) 2 Page - Texas Instruments |
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THS3061D Datasheet(HTML) 2 Page - Texas Instruments |
2 / 33 page THS3061 THS3062 SLOS394B – JULY 2002 – REVISED NOVEMBER 2009 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range unless otherwise noted. (1) VS Supply voltage ±16.5 V VI Input voltage ±VS IO Output current 200 mA VID Differential input voltage ±3 V Continuous power dissipation See Dissipation Ratings Table TJ Maximum junction temperature +150°C TJ (2) Maximum junction temperature, continuous operation, long term reliability +125°C Tstg Storage temperature range –65°C to +150°C (1) The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device. PACKAGE DISSIPATION RATINGS POWER RATING θJC θJA (TJ = +125°C) (2) PACKAGE (°C/W) (°C/W)(1) TA ≤ +25°C TA = +85°C D (8 pin) 38.3 97.5 1.02 W 410 mW DDA (8 pin)(3) 9.2 45.8 2.18 W 873 mW DGN (8 pin) (3) 4.7 58.4 1.71 W 680 mW (1) This data was taken using the JEDEC High-K test PCB. (2) This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3 in x 3 in PCB. (3) The THS306x may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package. RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT Dual supply ±5 ±15 Supply voltage V Single supply 10 30 2 Submit Documentation Feedback Copyright © 2002–2009, Texas Instruments Incorporated Product Folder Link(s): THS3061 THS3062 |
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