MPX5100/MPXV5100 SERIES

MOTOROLA

Motorola Sensor Device Data

3

ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING

Figure 2 shows the sensor output signal relative to pressure

input. Typical, minimum, and maximum output curves are

shown for operation over a temperature range of 0° to 85°C

using the decoupling circuit shown in Figure 4. The output will

saturate outside of the specified pressure range.

Figure 3 illustrates both the Differential/Gauge and the Abso-

lute Sensing Chip in the basic chip carrier (Case 867). A fluoro-

silicone gel isolates the die surface and wire bonds from the

environment, while allowing the pressure signal to be transmit-

ted to the sensor diaphragm.

The MPX5100/MPXV5100 series pressure sensor operating

characteristics, and internal reliability and qualification tests are

based on use of dry air as the pressure media. Media, other

than dry air, may have adverse effects on sensor performance

and long-term reliability. Contact the factory for information re-

garding media compatibility in your application.

Figure 4 shows the recommended decoupling circuit for in-

terfacing the output of the integrated sensor to the A/D input of

a microprocessor or microcontroller. Proper decoupling of the

power supply is recommended.

Figure 1.

Figure 2. Output versus Pressure Differential

Figure 3. Cross-Sectional Diagrams

(Not to Scale)

Figure 4. Recommended Power Supply Decoupling and Output Filtering

(For additional output filtering, please refer to Application Note AN1646)

5

4

3

2

1

0

0

10

20

30

40

50

60

70

80

90

100

PRESSURE (kPa)

Transfer Function MPX5100D/MPX5100G/MPXV5100G Series

PE = 2.5

TM = 1

Temperature = 0–85°C

MAX

MIN

TYPICAL

110

OFFSET

(TYP)

ABSOLUTE ELEMENT

DIE

BOND

STAINLESS STEEL

METAL COVER

EPOXY PLASTIC

CASE

DIE

FLUORO SILICONE

GEL DIE COAT

WIRE BOND

LEAD FRAME

DIFFERENTIAL/GAUGE ELEMENT

DIE

BOND

EPOXY PLASTIC

CASE

STAINLESS STEEL

METAL COVER

FLUORO SILICONE

GEL DIE COAT

DIE

LEAD FRAME

WIRE BOND

IPS

+5 V

1.0

µF0.01 µF

OUTPUT

GND

470 pF

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com