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MPX5100A Datasheet(PDF) 3 Page - Motorola, Inc |
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MPX5100A Datasheet(HTML) 3 Page - Motorola, Inc |
3 / 12 page MPX5100/MPXV5100 SERIES MOTOROLA Motorola Sensor Device Data 3 ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 3 illustrates both the Differential/Gauge and the Abso- lute Sensing Chip in the basic chip carrier (Case 867). A fluoro- silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmit- ted to the sensor diaphragm. The MPX5100/MPXV5100 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information re- garding media compatibility in your application. Figure 4 shows the recommended decoupling circuit for in- terfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 1. Figure 2. Output versus Pressure Differential Figure 3. Cross-Sectional Diagrams (Not to Scale) Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) 5 4 3 2 1 0 0 10 20 30 40 50 60 70 80 90 100 PRESSURE (kPa) Transfer Function MPX5100D/MPX5100G/MPXV5100G Series Vout = VS x (0.009 x P + 0.04) ± (Pressure Error x Temperature Factor x 0.009 x VS) VS = 5.0 V ± 0.25 Vdc PE = 2.5 TM = 1 Temperature = 0–85°C MAX MIN TYPICAL 110 OFFSET (TYP) ABSOLUTE ELEMENT DIE BOND STAINLESS STEEL METAL COVER EPOXY PLASTIC CASE DIE FLUORO SILICONE GEL DIE COAT WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT DIE BOND EPOXY PLASTIC CASE STAINLESS STEEL METAL COVER FLUORO SILICONE GEL DIE COAT DIE LEAD FRAME WIRE BOND IPS +5 V 1.0 µF0.01 µF VS Vout OUTPUT GND 470 pF Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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