LMK03000, LMK03000C, LMK03000D, LMK03001

LMK03001C, LMK03001D, LMK03033, LMK03033C

SNAS381O – NOVEMBER 2006 – REVISED MARCH 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

3

Electrical Specifications

3.1

Absolute Maximum Ratings

(1) (2) (3)

Parameter

Symbol

Ratings

Units

Power Supply Voltage

-0.3 to 3.6

V

Input Voltage

V

Storage Temperature Range

-65 to 150

°C

Lead Temperature (solder 4 s)

+260

°C

Junction Temperature

125

°C

(1)

"Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or

other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating

Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.

(2)

This device is a high performance integrated circuit with ESD handling precautions. Handling of this device should only be done at ESD

protected work stations. The device is rated to a HBM-ESD of > 2 kV, a MM-ESD of > 200 V, and a CDM-ESD of > 1.2 kV.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

3.2

Recommended Operating Conditions

Parameter

Symbol

Min

Typ

Max

Units

Ambient Temperature

-40

25

85

°C

Power Supply Voltage

3.15

3.3

3.45

V

3.3

Package Thermal Resistance

Package

27.4° C/W

5.8° C/W

(1)

Specification assumes 16 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC board. These

vias play a key role in improving the thermal performance of the WQFN. It is recommended that the maximum number of vias be used in

the board layout.

6

Electrical Specifications

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