SN75DP139

SLLS977E – APRIL 2009 – REVISED SEPTEMBER 2014

www.ti.com

Table 1. Control Pin Lookup Table (continued)

SIGNAL

STATE

DESCRIPTION

VSadj

4.02 k

Ω

Output Voltage

Driver output voltage swing precision control to aid with system compliance

±5%

Swing Contol

HPDINV

H

HPD Inversion

HPD_SOURCE VOH =0.9V (typical) and HPD logic is inverted

L

HPD non-

HPD_SOURCE VOH =3.2V (typical) and HPD logic is non-inverted

inversion

SRC

H

Edge Rate:

SRC helps to slow down the rise and fall time. SRC =High adds ~60ps to the rise

Slowest

and fall time of the TMDS differential output signals in addition to the I2C_EN pin

selection (recommended setting)

L

Edge Rate: Slow

SRC helps to slow down the rise and fall time. SRC =Low adds ~30ps to the rise

selection

Hi-Z

Edge Rate

Leaving the SRC pin High Z, will keep the default rise and fall time of the TMDS

It is recommended that an external resistor-divider (less than 100 k

Ω) is used so

that voltage on this pin = VCC/2, if Hi-Z logic level is intended on this pin.

OVS

H

Offset 1

DDC source side VOL and VIL offset range 1

L

Offset 2

DDC source side VOL and VIL offset range 2

Hi-Z

Offset 3

DDC source side VOL and VIL offset range 3

It is recommended that an external resistor-divider (less than 100 k

Ω) is used so

that voltage on this pin = VCC/2, if Hi-Z logic level is intended on this pin.

DDC_EN

H

DDC Buffer

DDC Buffer is enabled

enabled

L

DDC buffer

DDC Buffer is disabled

disabled

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

3.6

V

Main Link Input (IN_Dx) differential voltage

–0.3

VCC + 0.3

V

TMDS Outputs (OUT_Dx)

–0.3

VCC + 0.3

Voltage range

HPD_SOURCE, SDA_SOURCE, SCL_SOURCE, OVS, DDC_EN, VSadj,

–0.3

VCC + 0.3

HPD_SINK, SDA_SINK, SCL_SINK, OE_EN, HPDINV

–0.3

5.5

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to network ground terminal.

6.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–55

150

°C

–10

10

kV

Electrostatic discharge

–1.5

1.5

–200

200

V

(1)

Tested in accordance with JEDEC Standard 22, Test Method A114-B

(2)

Tested in accordance with JEDEC Standard 22, Test Method C101-A

(3)

Tested in accordance with JEDEC Standard 22, Test Method A115-A

6

Submit Documentation Feedback

Copyright © 2009–2014, Texas Instruments Incorporated

Product Folder Links: SN75DP139