LMC6041

SNOS610E – DECEMBER 1994 – REVISED MARCH 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Differential Input Voltage

±Supply Voltage

16V

Lead Temperature

(Soldering, 10 sec.)

260°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

110°C

500V

Current at Input Pin

±5 mA

Current at Output Pin

±18 mA

Current at Power Supply Pin

35 mA

Voltage at Input/Output Pin

− 0.3V

Power Dissipation

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating conditions indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test

conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 110°C. Output currents in excess of ±30 mA over long term may adversely

affect reliability.

(4)

(5)

Human body model, 1.5 k

Ω in series with 100 pF.

(6)

Operating Ratings

Temperature Range

LMC6041AI, LMC6041I

Supply Voltage

4.5V

Power Dissipation

Thermal Resistance (

(2)

8-Pin PDIP package

101°C/W

8-Pin SOIC package

165°C/W

(1)

For operating at elevated temperatures the device must be derated based on the thermal resistance

(2)

All numbers apply for packages soldered directly into a PC board.

2

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