4

LM809, LM810

SNVS052E – SEPTEMBER 1999 – REVISED APRIL 2016

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Copyright © 1999–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

6 Specifications

6.1 Absolute Maximum Ratings

see

(1) (2)

MIN

MAX

UNIT

Input supply voltage

–0.3

6

V

Output voltage

RESET, RESET

–0.3

V

Input current

20

mA

Output current

RESET, RESET

20

mA

Rate of rise

100

V/µs

Continuous power dissipation

320

mW

Lead temperature (soldering, 10 s)

300

°C

–40

105

°C

125

°C

–65

160

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions. Pins listed as ±200 V may actually have higher performance.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±200

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage range

1.0

5.5

V

1.2

5.5

Supply Current

LM8xx: 4.63, 4.38, 4.00

18

60

µA

100

LM8xx: 3.08, 2.93, 2.63, 2.45

15

50

100

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

LM809, LM810

UNIT

DBZ (SOT-23)

3 PINS

Junction-to-ambient thermal resistance

252.0

°C/W

Junction-to-case (top) thermal resistance

113.3

°C/W

Junction-to-board thermal resistance

53.5

°C/W

Junction-to-top characterization parameter

9.9

°C/W

Junction-to-board characterization parameter

52.6

°C/W

Junction-to-case (bottom) thermal resistance

—

°C/W