See mechanical drawings for dimensions.

DBV PACKAGE

(TOP VIEW)

DCK PACKAGE

(TOP VIEW)

YZP PACKAGE

(BOTTOM VIEW)

2

GND

V

CC

5

3

4

A

Y

1

6

1

S

Y

0

3

4

A

2

GND

Y

1

5

1

S

V

CC

6

Y

0

2

GND

V

CC

1

5

S

A

4

3

Y

1

6

Y

0

DRY PACKAGE

(TOP VIEW)

GND

V

CC

S

6

5

4

2

3

A

Y

1

Y

0

1

S

A

DSF PACKAGE

(TOP VIEW)

GND

Y

0

Y

1

V

CC

6

5

4

2

3

1

SN74LVC1G18

www.ti.com

SCES406K – JULY 2002 – REVISED JULY 2012

1-OF-2 NONINVERTING DEMULTIPLEXER

WITH 3-STATE DESELECTED OUTPUT

Check for Samples: SN74LVC1G18

1

FEATURES

2

•

Available in the Texas Instruments NanoFree™

•

Package

Operation

•

•

Latch-Up Performance Exceeds 100 mA

Per JESD 78, Class II

•

Inputs Accept Voltages to 5.5 V

•

ESD Protection Exceeds JESD 22

•

–

2000-V Human-Body Model (A114-A)

•

Low Power Consumption, 10-

–

200-V Machine Model (A115-A)

•

±24-mA Output Drive at 3.3 V

–

1000-V Charged-Device Model (C101)

•

•

DESCRIPTION/ORDERING INFORMATION

The SN74LVC1G18 is a 1-of-2 noninverting demultiplexer with a 3-state output. This device buffers the data on

input A and passes it to either output Y0 or Y1, depending on whether the state of the select (S) input is low or

high, respectively.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2002–2012, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.