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SSM2019BN Datasheet(PDF) 8 Page - Analog Devices |
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SSM2019BN Datasheet(HTML) 8 Page - Analog Devices |
8 / 8 page REV. 0 –8– SSM2019 OUTLINE DIMENSIONS 8-Lead Plastic Dual In-Line Package [PDIP] (N-8) Dimensions shown in inches and (millimeters) SEATING PLANE 0.180 (4.57) MAX 0.150 (3.81) 0.130 (3.30) 0.110 (2.79) 0.060 (1.52) 0.050 (1.27) 0.045 (1.14) 8 1 4 5 0.295 (7.49) 0.285 (7.24) 0.275 (6.98) 0.100 (2.54) BSC 0.375 (9.53) 0.365 (9.27) 0.355 (9.02) 0.150 (3.81) 0.135 (3.43) 0.120 (3.05) 0.015 (0.38) 0.010 (0.25) 0.008 (0.20) 0.325 (8.26) 0.310 (7.87) 0.300 (7.62) 0.022 (0.56) 0.018 (0.46) 0.014 (0.36) CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN COMPLIANT TO JEDEC STANDARDS MO-095AA 0.015 (0.38) MIN 16-Lead Standard Small Outline Package [SOIC] Wide Body (RW-16) Dimensions shown in millimeters and (inches) CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN COMPLIANT TO JEDEC STANDARDS MS-013AA SEATING PLANE 0.30 (0.0118) 0.10 (0.0039) 0.51 (0.0201) 0.33 (0.0130) 2.65 (0.1043) 2.35 (0.0925) 1.27 (0.0500) BSC 16 9 8 1 10.65 (0.4193) 10.00 (0.3937) 7.60 (0.2992) 7.40 (0.2913) 10.50 (0.4134) 10.10 (0.3976) 0.32 (0.0126) 0.23 (0.0091) 8 0 0.75 (0.0295) 0.25 (0.0098) 45 1.27 (0.0500) 0.40 (0.0157) COPLANARITY 0.10 8-Lead Standard Small Outline Package [SOIC] * Narrow Body (RN-8) Dimensions shown in millimeters and (inches) 0.25 (0.0098) 0.19 (0.0075) 1.27 (0.0500) 0.41 (0.0160) 0.50 (0.0196) 0.25 (0.0099) 45 8 0 1.75 (0.0688) 1.35 (0.0532) SEATING PLANE 0.25 (0.0098) 0.10 (0.0040) 85 4 1 5.00 (0.1968) 4.80 (0.1890) 4.00 (0.1574) 3.80 (0.1497) 1.27 (0.0500) BSC 6.20 (0.2440) 5.80 (0.2284) 0.51 (0.0201) 0.33 (0.0130) COPLANARITY 0.10 CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN COMPLIANT TO JEDEC STANDARDS MS-012AA *Consult factory for availability. BUS SUMMING AMPLIFIER In addition to its use as a microphone preamplifier, the SSM2019 can be used as a very low noise summing amplifier. Such a circuit is particularly useful when many medium impedance outputs are summed together to produce a high effective noise gain. The principle of the summing amplifier is to ground the SSM2019 inputs. Under these conditions, Pins 1 and 8 are ac virtual grounds sitting about 0.55 V below ground. To remove the 0.55 V offset, the circuit of Figure 5 is recommended. A2 forms a “servo” amplifier feeding the SSM2019 inputs. This places Pins l and 8 at a true dc virtual ground. R4 in conjunction with C2 removes the voltage noise of A2, and in fact just about any operational amplifier will work well here since it is removed from the signal path. If the dc offset at Pins l and 8 is not too critical, then the servo loop can be replaced by the diode biasing scheme of Figure 5. If ac coupling is used throughout, then Pins 2 and 3 may be directly grounded. – IN VOUT SSM2019 R4 5.1k R3 33k C1 0.33 F R2 6.2k C2 200 F + IN A2 R5 10k V IN4148 TO PINS 2 AND 3 Figure 5. Bus Summing Amplifier |
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