PACKAGE OPTION ADDENDUM

www.ti.com

9-Mar-2016

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

PCM1702P

OBSOLETE

PDIP

N

16

TBD

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PCM1702P

PCM1702P-J

OBSOLETE

PDIP

N

16

TBD

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PCM1702P

J

PCM1702P-JG4

OBSOLETE

PDIP

N

16

TBD

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PCM1702P-K

OBSOLETE

PDIP

N

16

TBD

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PCM1702P

K

PCM1702P-KG4

OBSOLETE

PDIP

N

16

TBD

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PCM1702PG4

OBSOLETE

PDIP

N

16

TBD

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PCM1702U

OBSOLETE

SO

NS

20

TBD

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PCM1702

PCM1702U-2/2K

OBSOLETE

SO

NS

20

TBD

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PCM1702U-2/2KE6

OBSOLETE

SO

NS

20

TBD

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PCM1702U-J

OBSOLETE

SO

NS

20

TBD

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PCM1702

J

PCM1702U-JE6

OBSOLETE

SO

NS

20

TBD

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PCM1702U-K

OBSOLETE

SO

NS

20

TBD

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PCM1702

K

PCM1702U-KE6

OBSOLETE

SO

NS

20

TBD

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PCM1702U/2K

OBSOLETE

SO

NS

20

TBD

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PCM1702

PCM1702U/2KE6

OBSOLETE

SO

NS

20

TBD

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PCM1702UE6

OBSOLETE

SO

NS

20

TBD

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ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.