PC16550D

SNLS378C – JUNE 1995 – REVISED MAY 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.5

7

V

Power Dissipation

1

W

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Ambient Temperature

0

25

70

°C

Supply Voltage

4.5

5

5.5

V

7.4 Electrical Characteristics

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Clock input low voltage

–0.5

0.8

V

Clock input high voltage

2.0

V

Input low voltage

–0.5

0.8

V

Input high voltage

2

V

Output low voltage

(1)

0.4

V

Output high voltage

(1)

2.4

V

Average power supply current

SIN, DSR, DCD, CTS, RI = 2.0 V,

15

mA

All other inputs = 0.8 V

Input leakage

±10

mA

Clock leakage

±10

mA

TRI-STATE leakage

1) Chip deselected

±20

mA

2) WRITE mode, chip selected

0.8

V

2

V

Clock input capacitance

7

9

pF

Clock output capacitance

7

9

pF

Input capacitance

5

7

pF

Output capacitance

6

8

pF

Input/Output capacitance

10

12

pF

(1)

Does not apply to XOUT.

8

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