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SN74ALVC16245DGGR Datasheet(PDF) 1 Page - Texas Instruments |
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SN74ALVC16245DGGR Datasheet(HTML) 1 Page - Texas Instruments |
1 / 10 page SN74ALVC16245 16BIT BUS TRANSCEIVER WITH 3STATE OUTPUTS SCAS419D − JANUARY 1993 − REVISED AUGUST 1995 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 D EPIC (Enhanced-Performance Implanted CMOS) Submicron Process D Member of the Texas Instruments Widebus Family D ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) D Latch-Up Performance Exceeds 250 mA Per JEDEC Standard JESD-17 D Bus Hold on Data Inputs Eliminates the Need for External Pullup / Pulldown Resistors D Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages description The SN74ALVC16245 16-bit (dual-octal) noninverting bus transceiver is designed for 2.3-V to 3.6-V VCC operation; it is tested at 2.5-V, 2.7-V, and 3.3-V VCC. The SN74ALVC16245 is designed for asynchronous communication between data buses. The control-function implementation minimizes external timing requirements. This device can be used as two 8-bit transceivers or one 16-bit transceiver. It allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses are effectively isolated. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. The SN74ALVC16245 is available in TI’s shrink small-outline (DL) and thin shrink small-outline (DGG) packages, which provide twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area. The SN74ALVC16245 is characterized for operation from − 40 °C to 85°C. FUNCTION TABLE (each 8-bit section) INPUTS OPERATION OE DIR OPERATION L L B data to A bus L H A data to B bus H X Isolation Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DGG OR DL PACKAGE (TOP VIEW) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 1DIR 1B1 1B2 GND 1B3 1B4 VCC 1B5 1B6 GND 1B7 1B8 2B1 2B2 GND 2B3 2B4 VCC 2B5 2B6 GND 2B7 2B8 2DIR 1OE 1A1 1A2 GND 1A3 1A4 VCC 1A5 1A6 GND 1A7 1A8 2A1 2A2 GND 2A3 2A4 VCC 2A5 2A6 GND 2A7 2A8 2OE PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 1995, Texas Instruments Incorporated EPIC and Widebus are trademarks of Texas Instruments Incorporated. |
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