SN74LVC1G374

SINGLE DTYPE FLIPFLOP

WITH 3STATE OUTPUT

SCES520A − DECEMBER 2003 − REVISED JUNE 2004

1

POST OFFICE BOX 655303

NanoStar

 and NanoFree Packages

Operation

Per JESD 78, Class II

− 2000-V Human-Body Model (A114-A)

− 200-V Machine Model (A115-A)

− 1000-V Charged-Device Model (C101)

description/ordering information

The SN74LVC1G374 features a 3-state output designed specifically for driving highly capacitive or relatively

low-impedance loads. This device is particularly suitable for implementing buffer registers, input/output (I/O)

ports, bidirectional bus drivers, and working registers.

NanoStar

 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

On the positive transition of the clock (CLK) input, the Q output is set to the logic level set up at the data (D)

input.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

NanoStar

 − WCSP (DSBGA)

0.23-mm Large Bump − YEP

Reel of 3000

SN74LVC1G374YEPR

_ _ _D4_

−40 C to 85 C

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

Reel of 3000

SN74LVC1G374YZPR

_ _ _D4_

−40

°C to 85°C

SOT (SOT-23) − DBV

Reel of 3000

SN74LVC1G374DBVR

CA4_

SOT (SOT-23) − DBV

Reel of 250

SN74LVC1G374DBVT

CA4_

SOT (SC-70) − DCK

Reel of 3000

SN74LVC1G374DCKR

D4_

SOT (SC-70) − DCK

Reel of 250

SN74LVC1G374DCKT

D4_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one

following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition

(1 = SnPb,

Copyright

 2004, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar and NanoFree are trademarks of Texas Instruments.

DBV OR DCK PACKAGE

(TOP VIEW)

1

2

3

6

5

4

CLK

GND

D

OE

Q

3

2

1

4

5

6

D

GND

CLK

Q

OE

YEP OR YZP PACKAGE

(BOTTOM VIEW)

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.