Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.COM

X  

K4S161622E-TC60 Datasheet(PDF) 11 Page - Samsung semiconductor

Part # K4S161622E-TC60
Description  1M x 16 SDRAM
Download  42 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

K4S161622E-TC60 Datasheet(HTML) 11 Page - Samsung semiconductor

Back Button K4S161622E-TC60 Datasheet HTML 7Page - Samsung semiconductor K4S161622E-TC60 Datasheet HTML 8Page - Samsung semiconductor K4S161622E-TC60 Datasheet HTML 9Page - Samsung semiconductor K4S161622E-TC60 Datasheet HTML 10Page - Samsung semiconductor K4S161622E-TC60 Datasheet HTML 11Page - Samsung semiconductor K4S161622E-TC60 Datasheet HTML 12Page - Samsung semiconductor K4S161622E-TC60 Datasheet HTML 13Page - Samsung semiconductor K4S161622E-TC60 Datasheet HTML 14Page - Samsung semiconductor K4S161622E-TC60 Datasheet HTML 15Page - Samsung semiconductor Next Button
Zoom Inzoom in Zoom Outzoom out
 11 / 42 page
background image
K4S161622E
CMOS SDRAM
Rev 1.1 Jan '03
DEVICE OPERATIONS
ADDRESS INPUTS (A0 ~ A10/AP)
: In case x 4
The 21 address bits are required to decode the 2,097,152 word
locations are multiplexed into 11 address input pins (A0 ~ A10/
AP). The 11 bit row addresses are latched along with RAS and
BA during bank activate command. The 10 bit column
addresses are latched along with CAS, WE and BA during read
or write command.
: In case x 8
The 20 address bits are required to decode the 1,048,576 word
locations are multiplexed into 11 address input pins (A0 ~ A10/
AP). The 11 bit row addresses are latched along with RAS and
BA during bank activate command. The 9 bit column addresses
are latched along with CAS, WE and BA during read or write
command.
: In case x 16
The 19 address bits are required to decode the 524,288 word
locations are multiplexed into 11 address input pins (A0 ~ A10/
AP). The 11 bit row addresses are latched along with RAS and
BA during bank activate command. The 8 bit column addresses
are latched along with CAS, WE and BA during read or write
command.
NOP and DEVICE DESELECT
When RAS, CAS and WE are high, the SDRAM performs no
operation (NOP). NOP does not initiate any new operation, but
is needed to complete operations which require more than sin-
gle clock cycle like bank activate, burst read, auto refresh, etc.
The device deselect is also a NOP and is entered by asserting
CS high. CS high disables the command decoder so that RAS,
CAS, WE and all the address inputs are ignored.
POWER-UP
SDRAMs must be powered up and initialized in a pre-
defined manner to prevent undefined operations.
1. Apply power and start clock. Must maintain CKE= "H", DQM=
"H" and the other pins are NOP condition at the inputs.
2. Maintain stable power, stable clock and NOP input condition
for a minimum of 200us.
3. Issue precharge commands for both banks of the devices.
4. Issue 2 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode reg-
ister.
cf.) Sequence of 4 & 5 is regardless of the order.
The device is now ready for normal operation.
CLOCK (CLK)
The clock input is used as the reference for all SDRAM opera-
tions. All operations are synchronized to the positive going edge
of the clock. The clock transitions must be monotonic between
VIL and VIH. During operation with CKE high all inputs are
assumed to be in a valid state (low or high) for the duration of
set-up and hold time around positive edge of the clock in order
to function well Q perform and ICC specifications.
CLOCK ENABLE (CKE)
The clock enable(CKE) gates the clock onto SDRAM. If CKE
goes low synchronously with clock (set-up and hold time are the
same as other inputs), the internal clock is suspended from the
next clock cycle and the state of output and burst address is fro-
zen as long as the CKE remains low. All other inputs are ignored
from the next clock cycle after CKE goes low. When all banks
are in the idle state and CKE goes low synchronously with clock,
the SDRAM enters the power down mode from the next clock
cycle. The SDRAM remains in the power down mode ignoring
the other inputs as long as CKE remains low. The power down
exit is synchronous as the internal clock is suspended. When
CKE goes high at least "1CLK + tSS" before the high going edge
of the clock, then the SDRAM becomes active from the same
clock edge accepting all the input commands.
BANK ADDRESS (BA)
: In case x 4
This SDRAM is organized as two independent banks of
2,097,152 words x 4 bits memory arrays. The BA input is latched
at the time of assertion of RAS and CAS to select the bank to be
used for the operation. The bank select BA is latched at bank
active, read, write, mode register set and precharge operations.
: In case x 8
This SDRAM is organized as two independent banks of
1,048,576 words x 8 bits memory arrays. The BA input is latched
at the time of assertion of RAS and CAS to select the bank to be
used for the operation. The bank select BA is latched at bank
active, read, write, mode register set and precharge operations.
: In case x 16
This SDRAM is organized as two independent banks of 524,288
words x 16 bits memory arrays. The BA input is latched at the
time of assertion of RAS and CAS to select the bank to be used
for the operation. The bank select BA is latched at bank active,
read, write, mode register set and precharge operations.


Similar Part No. - K4S161622E-TC60

ManufacturerPart #DatasheetDescription
logo
Samsung semiconductor
K4S161622D SAMSUNG-K4S161622D Datasheet
1Mb / 41P
   512K x 16Bit x 2 Banks Synchronous DRAM
K4S161622D-TC/L10 SAMSUNG-K4S161622D-TC/L10 Datasheet
1Mb / 41P
   512K x 16Bit x 2 Banks Synchronous DRAM
K4S161622D-TC/L55 SAMSUNG-K4S161622D-TC/L55 Datasheet
1Mb / 41P
   512K x 16Bit x 2 Banks Synchronous DRAM
K4S161622D-TC/L60 SAMSUNG-K4S161622D-TC/L60 Datasheet
1Mb / 41P
   512K x 16Bit x 2 Banks Synchronous DRAM
K4S161622D-TC/L70 SAMSUNG-K4S161622D-TC/L70 Datasheet
1Mb / 41P
   512K x 16Bit x 2 Banks Synchronous DRAM
More results

Similar Description - K4S161622E-TC60

ManufacturerPart #DatasheetDescription
logo
Taiwan Memory Technolog...
T431616A TMT-T431616A Datasheet
1Mb / 31P
   1M x 16 SDRAM????
logo
Samsung semiconductor
DS_K4S161622D SAMSUNG-DS_K4S161622D Datasheet
680Kb / 43P
   1M x 16 SDRAM
logo
Winbond
W986416CH WINBOND-W986416CH Datasheet
2Mb / 42P
   1M x 16 BIT x 4 BANKS SDRAM
W9864G6DB WINBOND-W9864G6DB Datasheet
1Mb / 48P
   1M x 4 BANKS x 16 BITS SDRAM
W9864G6KH-5-TR WINBOND-W9864G6KH-5-TR Datasheet
693Kb / 42P
   1M X 4 BANKS X 16 BITS SDRAM
W986416DH WINBOND-W986416DH Datasheet
1Mb / 48P
   1M X 4 BANKS X 16 BITS SDRAM
W9864G6JH WINBOND-W9864G6JH_13 Datasheet
841Kb / 43P
   1M x 4 BANKS x 16 BITS SDRAM
W9864G6JB WINBOND-W9864G6JB Datasheet
879Kb / 43P
   1M X 4 BANKS X 16 BITS SDRAM
W9864G6JT WINBOND-W9864G6JT_13 Datasheet
867Kb / 42P
   1M x 4 BANKS x 16 BITS SDRAM
W9864G6KH WINBOND-W9864G6KH Datasheet
705Kb / 42P
   1M X 4 BANKS X 16 BITS SDRAM
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42


Datasheet Download

Go To PDF Page


Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com