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SN75LBC172N Datasheet(PDF) 9 Page - Texas Instruments

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Part # SN75LBC172N
Description  QUADRUPLE LOW-POWER DIFFERENTIAL LINE DRIVER
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

SN75LBC172N Datasheet(HTML) 9 Page - Texas Instruments

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SN65LBC172, SN75LBC172
QUADRUPLE LOW POWER DIFFERENTIAL LINE DRIVER
SLLS163E − JULY 1993 − REVISED APRIL 2006
9
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
THERMAL CHARACTERISTICS OF IC PACKAGES
ΘJA (Junction-to-Ambient Thermal Resistance) is defined as the difference in junction temperature to ambient temperature
divided by the operating power
ΘJA is NOT a constant and is a strong function of
D the PCB design (50% variation)
D altitude (20% variation)
D device power (5% variation)
ΘJA can be used to compare the thermal performance of packages if the specific test conditions are defined and used.
Standardized testing includes specification of PCB construction, test chamber volume, sensor locations, and the thermal
characteristics of holding fixtures. ΘJA is often misused when it is used to calculate junction temperatures for other
installations.
TI uses two test PCBs as defined by JEDEC specifications. The low-k board gives average in-use condition thermal
performance and consists of a single trace layer 25 mm long and 2-oz thick copper. The high-k board gives best case in−use
condition and consists of two 1-oz buried power planes with a single trace layer 25 mm long with 2-oz thick copper. A 4%
to 50% difference in
ΘJA can be measured between these two test cards
ΘJC (Junction-to-Case Thermal Resistance) is defined as difference in junction temperature to case divided by the
operating power. It is measured by putting the mounted package up against a copper block cold plate to force heat to flow
from die, through the mold compound into the copper block.
ΘJC is a useful thermal characteristic when a heatsink is applied to package. It is NOT a useful characteristic to predict
junction temperature as it provides pessimistic numbers if the case temperature is measured in a non-standard system and
junction temperatures are backed out. It can be used with
ΘJB in 1-dimensional thermal simulation of a package system.
ΘJB (Junction-to-Board Thermal Resistance) is defined to be the difference in the junction temperature and the PCB
temperature at the center of the package (closest to the die) when the PCB is clamped in a cold−plate structure.
ΘJB is only
defined for the high-k test card.
ΘJB provides an overall thermal resistance between the die and the PCB. It includes a bit of the PCB thermal resistance
(especially for BGA’s with thermal balls) and can be used for simple 1-dimensional network analysis of package system
(see Figure 12).
Surface Node
qJC Calculated/Measured
Junction
qJB Calculated/Measured
PC Board
qCA Calculated
Ambient Node
Figure 12. Thermal Resistance


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