SN65LBC172, SN75LBC172

QUADRUPLE LOW POWER DIFFERENTIAL LINE DRIVER

SLLS163E − JULY 1993 − REVISED APRIL 2006

8

POST OFFICE BOX 655303

TYPICAL CHARACTERISTICS

Figure 10

IO − Output Current − mA

DIFFERENTIAL OUTPUT VOLTAGE

vs

OUTPUT CURRENT

3

2.5

2

1.5

1

0.5

90

80

70

60

50

40

30

20

10

0

0

100

VCC = 5 V

TA = 25°C

Figure 11

TA − Free-Air Temperature − °C

PROPAGATION DELAY TIME,

DIFFERENTIAL OUTPUT

vs

FREE-AIR TEMPERATURE

11

10

9

8

7

6

5

100

80

60

40

20

0

−20

−40

4

12

−60

13

14

RL = 54 Ω

CL = 50 pF

VCC = 5 V

THERMAL CHARACTERISTICS − DW PACKAGE

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Junction−to−ambient thermal reisistance,

θJA†

Low-K board, no air flow

96

Junction−to−ambient thermal reisistance,

θJA†

High-K board, no air flow

62.9

°C/W

Junction−to−board thermal reisistance,

θJB

High-K board, no air flow

39.6

°C/W

Junction−to−case thermal reisistance,

θJC

29.1

Average power dissipation, P(AVG)

All four channels maximum loading,

maximum signaling rate, RL = 54 Ω, input to

D is 10 Mbps 50% duty cycle square wave,

VCC = 5.25 V, TJ = 130 °C.

1100

mW

Ambient free−air temperature, TA

JEDEC high-K board model

−40

85

Ambient free−air temperature, TA

JEDEC high-K board model

−40

64

°C

Thermal shutdown junction temperature, TSD

165

C

† See TI application note literature number SZZA003, Package Thermal Characterization Methodologies, for an explanation of this parameter.